Boren Scholarships

Boren Scholarships, an initiative of the National Security Education Program, provide unique funding opportunities for U.S. undergraduate students to study less commonly taught languages in world regions critical to U.S. interests, and underrepresented in study abroad, including Africa, Asia, Central and Eastern Europe, Eurasia, Latin America, and the Middle East. The countries of Western Europe, Canada, Australia, and New Zealand are excluded. The 2016-17 application will be available in late-August.

Eligibility:          

  • A U.S. citizen at the time of application
  • A high school graduate, or have earned a GED
  • Matriculated in an undergraduate degree program located within the United States accredited by an accrediting body recognized by the U.S. Department of Education. Boren Scholars must remain matriculated in their undergraduate programs for the duration of the scholarship and may not graduate until the scholarship is complete.
  • Applying to a study abroad program that meets home institution standards in a country outside of Western Europe, Canada, Australia, or New Zealand.  Boren Scholarships are not for study in the United States.

How to Apply:

For applying this scholarship you must

 

  • Contact yourBoren campus representative
  • Submit the Boren Scholarship application
  • Completed letters of reference.
  • Submit Transcripts from all colleges and universities attended.
  • Submit Language self-assessment
  • Submit Language proficiency form
  • One pagestudy abroad program or if you set up a direct enrollment or individually arranged study abroad program, please provide two letters of support.

Award Amount:

Maximum scholarship awards are:

  • $8,000 for a summer program (special initiative for STEM students only; 8 weeks minimum)
  • $10,000 for a semester
  • $20,000 for a full academic year

Application Deadline:

 

Online application must be complete at 5:00 p.m. EST. All supplementary materials must arrive at IIE, at the given address.

Link to apply:

Official Application Page

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