The Fund for Education Abroad (FEA) is offering scholarships to U.S. citizens, permanent residents or DACA students currently enrolled as undergraduates in U.S. universities/colleges who plan to study abroad during one or more academic semester. FEA scholarships are designed for students seeking a rigorous overseas academic program, for nontraditional study abroad students, and for students with financial need. Up to $10,000 (Academic Year), $5,000 (fall/spring semester), prorated by no. of weeks, minimum $1,250 (summer) will be rewarded.
The Fund for Education Abroad (FEA) was established as a 501(c) (3) organization in 2010 to address the need for an independent study abroad scholarship provider.
- U.S. citizen or permanent resident of the U.S. (as of May 2015, they welcome applications from DACA students)
- Currently enrolled as an undergraduate at a college or university in the U.S. (graduate students are not eligible)
- Study abroad program must be eligible for credit at the student’s educational institution
- Study abroad program must include at least 4 weeks (30 days) in country/countries
How to Apply:
- For the 2016-2017 academic year (summer 2016, fall 2016, and spring 2017), the 2017-2018 application cycle (summer 2017, fall 2017, and spring 2018) will open November 16, 2016.
- The candidates can view the application through the given link: https://fea.applicationgateway.com/index.cfm?FuseAction=Security.ExistingUserLogin
- Financial aid form (requires input from financial aid)
- Faculty recommendation letter (maximum of 1)
- FEA anticipates that approximately 50 scholarships will be awarded in the 2016-2017 cycle, a number largely dependent on FEA fundraising
- FEA will award $5,000 scholarships to students who study abroad for one semester. Students who study abroad for two semesters will receive $10,000. Students who study abroad for other lengths of time will receive a pro-rated amount. Prorated by no. of weeks, minimum $1,250 (summer).
The application cycle closes on January 11, 2017, at 12:00pm EST.
Link for More Information: